Media Coverage

EEJournal

From Chiplet to Chiplet

September 23, 2019

A couple of months ago we talked about the new chip disintegration approach: chiplets. And even longer ago, we talked about zGlue’s fabric for interconnecting chiplets. But there are actually several ways in which chiplets are viewed as being co-assembled, which leaves the question, how are we going to connect these things together?

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EEJournal

Group Puzzles Out Silicon Specs

September 17, 2019

Someday, a new class of semiconductor companies will assemble their products Lego-style, mixing and matching dice from multiple companies. It’s a huge change that’s still a long way off.

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Libkefir: All Your Rules in One Bottle

September 10, 2019

With libkefir, learn how to translate TC flower rules from standard input into a single BPF program with just a few lines of code.

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Semiconductor Engineering

New Technologies To Support 3D-ICs

September 04, 2019

Experts at the Table: 3D design and packaging is creating new demand on tools and requires a tight ecosystem and sharing across the industry.

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Semiconductor Engineering

EDA Gears Up For 3D

August 26, 2019

Experts at the Table: What are the limitations today that are preventing 3D-ICs from becoming mainstream, and which companies pushing to make it happen?

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