Media Coverage

EEJournal

From Chiplet to Chiplet

September 23, 2019

A couple of months ago we talked about the new chip disintegration approach: chiplets. And even longer ago, we talked about zGlue’s fabric for interconnecting chiplets. But there are actually several ways in which chiplets are viewed as being co-assembled, which leaves the question, how are we going to connect these things together?

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EEJournal

Group Puzzles Out Silicon Specs

September 17, 2019

Someday, a new class of semiconductor companies will assemble their products Lego-style, mixing and matching dice from multiple companies. It’s a huge change that’s still a long way off.

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Semiconductor Engineering

New Technologies To Support 3D-ICs

September 04, 2019

Experts at the Table: 3D design and packaging is creating new demand on tools and requires a tight ecosystem and sharing across the industry.

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Semiconductor Engineering

EDA Gears Up For 3D

August 26, 2019

Experts at the Table: What are the limitations today that are preventing 3D-ICs from becoming mainstream, and which companies pushing to make it happen?

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EE Times Asia

The Whales Changing the Industry

July 30, 2019

The world’s seven largest data centers, aka the hyperscalers, have created huge chip markets, driving the semiconductor industry to new performance heights and cost floors. Some fear that they also are distracting chip vendors from the needs of smaller, more diverse users.

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